洗衣機管接頭注塑模具設計含11張CAD圖,洗衣機,管接頭,注塑,模具設計,11,十一,cad 1 SMT PROCESS SPECIFICATION 2 CONTENTS 1 SHIPPING, STORAGE and PRODUCTION ENVIRONMENT .......................................................4 1.1 General.....................................................................................................................................4 1.2 General shipping and storage conditions.................................................................................5 1.3 Storage and handling conditions for solder paste ....................................................................6 1.4 Storage and handling conditions for printed wiring boards PWBs .........................................6 1.5 Storage conditions for underfill epoxy materials.......................................................................7 1.6 Shelf life time for different component categories ....................................................................8 1.6.1 Expired material handling..................................................................................................8 1.7 Moisture sensitivity levels.........................................................................................................8 1.8 Drying (baking) moisture sensitive devices ..............................................................................9 1.8.1 Drying (baking) restrictions ...............................................................................................9 1.9 DRY STORAGE CONDITIONS..............................................................................................10 2 STENCIL PRINTING PROCESS SPECIFICATIONS...................................................................11 2.1 Paste specification .................................................................................................................11 2.2 Squeegee ...............................................................................................................................12 2.3 Stencil.....................................................................................................................................12 2.4 Support tables ........................................................................................................................13 2.5 Printing process parameters (stencil printing) ........................................................................13 2.6 Print result validation ..............................................................................................................14 3 Process control and monitoring ....................................................................................................15 3.1 Automated Optical Inspection, AOI ........................................................................................15 3.2 Location of the machine in the production line.......................................................................15 3.3 Utilization of inspection results ...............................................................................................15 3.4 Component and paste alarm limits.........................................................................................16 3.5 Specification limits for capability analyses .............................................................................17 4 PLACEMENT PROCESS SPECIFICATIONS ..............................................................................18 4.1 Nozzles...................................................................................................................................18 4.2 Feeders ..................................................................................................................................18 4.3 NC-Programs .........................................................................................................................18 4.4 Part Data / Vision processing .................................................................................................19 4.5 Placement process management data compatibility table .....................................................19 5 Dipping process ............................................................................................................................20 5.1 Dipping flux specification and handling instructions...............................................................20 5.1.1 Storage and handling instructions...................................................................................20 5.1.2 Flux specifications...........................................................................................................20 5.2 Dipping process specifications ...............................................................................................21 5.2.1 Dipping device.................................................................................................................21 5.2.2 Dipping process parameters ...........................................................................................21 6 Reflow soldering profile measurement..........................................................................................22 6.1 Profile measurement equipment ............................................................................................22 6.2 Reflow profile measurement method with standard calibration board....................................22 7 Standard, lead containing soldering process................................................................................23 7.1.1 Recommended reflow oven settings ...............................................................................24 8 Lead free soldering process..........................................................................................................25 8.1 Reflow profile definition for Pb-free process...........................................................................25 8.2 General Pb-free reflow soldering profile specification ............................................................26 8.3 Basic profile specification for standard calibration board in Pb-free process.........................27 8.4 Start-up settings for Pb-free process......................................................................................29 8.5 Reflow profile measurement on product PWBs......................................................................30 3 9 UnderfiLl process..........................................................................................................................31 9.1 General...................................................................................................................................31 10 NK ACA SMT Process Specification ......................................................................................33 10.1 ACA Technology Introduction .............................................................................................33 10.2 ACA Process ......................................................................................................................33 10.3 Anisotropic Conductive Film ...............................................................................................35 10.3.1 ACF Material Specification ..........................................................................................35 10.3.2 ACA Process Parameters............................................................................................36 10.3.3 Cooplanarity measurement .........................................................................................37 10.3.4 Measurement of bond line temperature.......................................................................37 10.3.5 Interposer ....................................................................................................................38 10.4 ACA Storage Conditions.....................................................................................................38 10.5 Interconnection Area Designing for Hitachi Chemical AC-2056T-45 ACF..........................39 10.6 Bonding Force Calculation..................................................................................................40 11 MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA.................................41 12 Specifications for visual inspection; error criteria, faults classification and training material..41 13 Related Documents................................................................................................................41 4 1 SHIPPING, STORAGE AND PRODUCTION ENVIRONMENT 1.1 General Global NK Workplace Resources (NWR) organization specifies and takes care of general environmental conditions in material storage and factory hall, containing: -heating -ventilation -air conditioning -water/sewage -fire extinguishing systems -cooling -special HVAC (vacuum, soldering exhaust etc.) -electrical AC and ESD protection should be take care by Time Zones and factories. Environmental conditions should be continuously monitored. Longer than four hour weighted average out-of-specification situations should trigger corrective actions. If tighter conditions are required or if these specifications/limits cant be remain local air conditioning (AC) systems like cooler/heater and laminar flow cabins must be used. More detailed and up-to-date environmental specifications can be found from Global NK Workplace Resources Intranet pages. 5 1.2 General shipping and storage conditions Expected shipping conditions (components and materials) 1 Relative humidity RH 15 % - 70% Temperature -5C...+40C General NK Storage conditions 2 Relative humidity RH 10%-70% Temperature Temperature 15C - 30C 3 Component packing level Components must be at least in the first level, so called intimate delivery packing: - MBB (Moisture Barrier Bag) for humidity sensitive components - ESD (Electro Static Discharge) protective packing - Air flow preventive plastic packing (vacuum or not, but tightly closed) - Cardboard box if nothing of above mentioned packing are used General storage requirements Materials are not allowed to be stored: - in direct sun shine, not even through windows - close to heater/cooler/humidifier/light source - close to outdoors so that temperature/humidity limits are repeatedly exceeded NK production conditions Relative humidity 35%-55% Temperature 20.5C 26.5C 1 External environment. Materials should be packed so that special requirements like maximum temperatures for underfill epoxy is not exceeded. Solder paste has its own specified shipping condition. 2 . Look special storage conditions for solder paste and underfill epoxy below 3 Components, esp. those having high mass (e.g. PWBs), should reach factory room temperature before entering process. 6 1.3 Storage and handling conditions for solder paste Solder paste storage and handling Storage temperature Refrigerator, 0 8 C or paste specific requirements Shelf storage time 6 months max. Storage time in room temperature General: 4 weeks (T= 20,5 - 25C), Alpha Metals OM 338T: 2 weeks Stabilization time before usage 4 hours Environment in shipping Temperature +5+25 C Handling instructions Do not store cartridges nozzle-end up Paste should warm up in room temperature without extra heating at least 4 hours Do not put paste into refrigerator if it has reach room temperature 1.4 Storage and handling conditions for printed wiring boards PWBs PWB delivery, handling and storage conditions Delivery package and storage Air evacuated (vacuum) Moisture Barrier Bag (MBB) according EIA- 583 class 2, 50 panels/bag, all from same manufacturing lot. X-out marked panels should be packed separately and marked according separate document Humidity Indicator Card (HIC), 5 levels, on the top of PWB stack Desiccant optional, must be placed so that panels dont bend Incoming inspection Check that MBB is not broken or HIC reading is 40% RH Actions if NOK: -return to vendor or -bake in 60 C, 5 hours, RH 5%, soldering within 24 hours Shelf time Look table below . Panels must be stored on flat shelf to prevent warpage (see section 1.5) Open time for bare PWBs NiAu plating: Soldering within 48 hours OSP plating: floor life limit 48 hours, time between solderings 24h Cleaning/ washing Not allowed 7 1.5 Storage conditions for underfill epoxy materials Material name and type Loctite 3593 Emerson dry storage time should be included. Dry storage specification Temperature 25 5 C Humidity 15 min), if more than 50% of paste volume is refilled or after paste collection together outside squeegee area paste should be kneeded 12 2.2 Squeegee Property Specification Squeegee blade material Ni or Titanium plated stainless steel with adequate stiffness for high speed printing. Thickness 275 10 m Squeegee holder angle* (critical parameter) 60 2.5 Squeegee width for DEK ERROR CRITERIA, FAULTS CLASSIFICATION AND TRAINING MATERIAL Visual inspection criteria applied at NK is defined in document NS055, SMD Workmanship Standard. This standard in mainly based on ANSI/IPC-A-610B, class 2, telecommunications. Same criteria are used also for assemblies manufactured by subcontractors. Applicable international standard ANSI/IPC-A-610B, class 2, telecommunications Error criteria and fault classification “SMD Workmanship Standard”, NS055. Training package NK training package “SMD Workmanship Standard”, NS055 or equivalent training material conforming to ANSI/IPC-A-610B. 13 RELATED DOCUMENTS NS055, SMD Workmanship Standard stored in Operation Global DocMan database EIA-583 Packing Material Standards for Moisture Sensitive Items EIA-541 Packing Material Standards for ESD Sensitive Items Both above mentioned standards are available also in NK Intranet. Lead Free Process specification in Operations Global DocMan database