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1 SMT PROCESS SPECIFICATION CONTENTS 1 SHIPPING STORAGE and PRODUCTION ENVIRONMENT 4 1 1 General 4 1 2 General shipping and storage conditions 5 1 3 Storage and handling conditions for solder paste 6 1 4 Storage and handling conditions for printed wiring boards PWBs 6 1 5 Storage conditions for underfill epoxy materials 7 1 6 Shelf life time for different component categories 8 1 6 1 Expired material handling 8 1 7 Moisture sensitivity levels 8 1 8 Drying baking moisture sensitive devices 9 1 8 1 Drying baking restrictions 9 1 9 DRY STORAGE CONDITIONS 10 2 STENCIL PRINTING PROCESS SPECIFICATIONS 11 2 1 Paste specification 11 2 2 Squeegee 12 2 3 Stencil 12 2 4 Support tables 13 2 5 Printing process parameters stencil printing 13 2 6 Print result validation 14 3 Process control and monitoring 15 3 1 Automated Optical Inspection AOI 15 3 2 Location of the machine in the production line 15 3 3 Utilization of inspection results 15 3 4 Component and paste alarm limits 16 3 5 Specification limits for capability analyses 17 4 PLACEMENT PROCESS SPECIFICATIONS 18 4 1 Nozzles 18 4 2 Feeders 18 4 3 NC Programs 18 4 4 Part Data Vision processing 19 4 5 Placement process management data compatibility table 19 5 Dipping process 20 5 1 Dipping flux specification and handling instructions 20 5 1 1 Storage and handling instructions 20 5 1 2 Flux specifications 20 5 2 Dipping process specifications 21 5 2 1 Dipping device 21 5 2 2 Dipping process parameters 21 6 Reflow soldering profile measurement 22 6 1 Profile measurement equipment 22 6 2 Reflow profile measurement method with standard calibration board 22 7 Standard lead containing soldering process 23 7 1 1 Recommended reflow oven settings 24 8 Lead free soldering process 25 8 1 Reflow profile definition for Pb free process 25 8 2 General Pb free reflow soldering profile specification 26 8 3 Basic profile specification for standard calibration board in Pb free process 27 8 4 Start up settings for Pb free process 29 8 5 Reflow profile measurement on product PWBs 30 2 9 UnderfiLl process 31 9 1 General 31 10 NK ACA SMT Process Specification 33 10 1 ACA Technology Introduction 33 10 2 ACA Process 33 10 3 Anisotropic Conductive Film 35 10 3 1 ACF Material Specification 35 10 3 2 ACA Process Parameters 36 10 3 3 Cooplanarity measurement 37 10 3 4 Measurement of bond line temperature 37 10 3 5 Interposer 38 10 4 ACA Storage Conditions 38 10 5 Interconnection Area Designing for Hitachi Chemical AC 2056T 45 ACF 39 10 6 Bonding Force Calculation 40 11 MANUAL SOLDERING PROCESS AND WORKMANSHIP CRITERIA 41 12 Specifications for visual inspection error criteria faults classification and training material 41 13 Related Documents 41 3 1 SHIPPING STORAGE AND PRODUCTION ENVIRONMENT 1 1 General Global NK Workplace Resources NWR organization specifies and takes care of general environmental conditions in material storage and factory hall containing heating ventilation air conditioning water sewage fire extinguishing systems cooling special HVAC vacuum soldering exhaust etc electrical AC and ESD protection should be take care by Time Zones and factories Environmental conditions should be continuously monitored Longer than four hour weighted average out of specification situations should trigger corrective actions If tighter conditions are required or if these specifications limits can t be remain local air conditioning AC systems like cooler heater and laminar flow cabins must be used More detailed and up to date environmental specifications can be found from Global NK Workplace Resources Intranet pages 4 1 2 General shipping and storage conditions Expected shipping conditions components and materials 1 Relative humidity RH 15 70 Temperature 5 C 40 C General NK Storage conditions 2 Relative humidity RH 10 70 Temperature Temperature 15 C 30 C 3 Component packing level Components must be at least in the first level so called intimate delivery packing MBB Moisture Barrier Bag for humidity sensitive components ESD Electro Static Discharge protective packing Air flow preventive plastic packing vacuum or not but tightly closed Cardboard box if nothing of above mentioned packing are used General storage requirements Materials are not allowed to be stored in direct sun shine not even through windows close to heater cooler humidifier light source close to outdoors so that temperature humidity limits are repeatedly exceeded NK production conditions Relative humidity 35 55 Temperature 20 5 C 26 5 C 1 External environment Materials should be packed so that special requirements like maximum temperatures for underfill epoxy is not exceeded Solder paste has it s own specified shipping condition 2 Look special storage conditions for solder paste and underfill epoxy below 3 Components esp those having high mass e g PWBs should reach factory room temperature before entering process 5 1 3 Storage and handling conditions for solder paste Solder paste storage and handling Storage temperature Refrigerator 0 8 C or paste specific requirements Shelf storage time 6 months max Storage time in room temperature General 4 weeks T 20 5 25 C Alpha Metals OM 338T 2 weeks Stabilization time before usage 4 hours Environment in shipping Temperature 5 25 C Handling instructions Do not store cartridges nozzle end up Paste should warm up in room temperature without extra heating at least 4 hours Do not put paste into refrigerator if it has reach room temperature 1 4 Storage and handling conditions for printed wiring boards PWBs PWB delivery handling and storage conditions Delivery package and storage Air evacuated vacuum Moisture Barrier Bag MBB according EIA 583 class 2 50 panels bag all from same manufacturing lot X out marked panels should be packed separately and marked according separate document Humidity Indicator Card HIC 5 levels on the top of PWB stack Desiccant optional must be placed so that panels don t bend Incoming inspection Check that MBB is not broken or HIC reading is 40 RH Actions if NOK return to vendor or bake in 60 C 5 hours RH 5 soldering within 24 hours Shelf time Look table below Panels must be stored on flat shelf to prevent warpage see section 1 5 Open time for bare PWBs NiAu plating Soldering within 48 hours OSP plating floor life limit 48 hours time between solderings 24h Cleaning washing Not allowed 6 1 5 Storage conditions for underfill epoxy materials Material name and type Loctite 3593 Emerson dry storage time should be included Dry storage specification Temperature 25 5 C Humidity 15 min if more than 50 of paste volume is refilled or after paste collection together outside squeegee area paste should be kneeded 11 2 2 Squeegee Property Specification Squeegee blade material Ni or Titanium plated stainless steel with adequate stiffness for high speed printing Thickness 275 10 m Squeegee holder angle critical parameter 60 2 5 Squeegee width for DEK ERROR CRITERIA FAULTS CLASSIFICATION AND TRAINING MATERIAL Visual inspection criteria applied at NK is defined in document NS055 SMD Workmanship Standard This standard in mainly based on ANSI IPC A 610B class 2 telecommunications Same criteria are used also for assemblies manufactured by subcontractors Applicable international standard ANSI IPC A 610B class 2 telecommunications Error criteria and fault classification SMD Workmanship Standard NS055 Training package NK training package SMD Workmanship Standard NS055 or equivalent training material conforming to ANSI IPC A 610B 13 RELATED DOCUMENTS NS055 SMD Workmanship Standard stored in Operation Global DocMan database EIA 583 Packing Material Standards for Moisture Sensitive Items EIA 541 Packing Material Standards for ESD Sensitive Items Both above mentioned standards are available also in NK Intranet Lead Free Process specification in Operations Global DocMan database 42 SMT 工藝說(shuō)明書(shū) 目錄 1 運(yùn)送 存儲(chǔ)和生產(chǎn)環(huán)境 3 1 1 概述 3 1 2 普通運(yùn)送和儲(chǔ)藏條件 4 1 3 錫膏的存儲(chǔ)和處理?xiàng)l件 5 1 4 印刷線路板 PWBs 的存儲(chǔ)和處理?xiàng)l件 5 1 5 環(huán)氧樹(shù)脂的儲(chǔ)藏條件 6 1 6 不同種類(lèi)的元件的擱板壽命期 6 1 7 潮濕靈敏性級(jí)別 7 1 8 烘干 烘焙 潮濕敏感器件 7 1 9 干貨存貯條件 8 2 絲網(wǎng)印刷工藝說(shuō)明 10 2 1 錫膏規(guī)格 10 2 2 刮刀 11 2 3 絲網(wǎng) 11 2 4 支撐臺(tái) 12 2 5 印刷工藝參數(shù) 絲網(wǎng)印刷 12 2 6 印刷結(jié)果確認(rèn) 13 3 印刷工藝控制和監(jiān)控 14 3 1 自動(dòng)光學(xué)檢測(cè) AOI 14 3 2 機(jī)器在生產(chǎn)線的位置 14 3 3 檢測(cè)結(jié)果的利用 14 3 4 元器件和錫膏的報(bào)警極限 14 3 5 能力 分析的規(guī)格限制 16 4 貼裝過(guò)程規(guī)范 17 4 1 吸嘴 17 4 2 飛達(dá) 17 4 3 數(shù)控程序 17 4 4 零件數(shù)據(jù) 視覺(jué)處理 18 4 5 貼裝進(jìn)程數(shù)據(jù)管理兼容表 18 5 點(diǎn)膠 工藝 19 5 1 點(diǎn)膠量規(guī)范和操作說(shuō)明 19 5 2 點(diǎn)膠工藝規(guī)范 20 6 回流焊曲線測(cè)量 21 6 1 曲線測(cè)量設(shè)備 21 6 2 校準(zhǔn)結(jié)合板的回流曲線測(cè)量方法 21 7 有鉛焊工藝 標(biāo)準(zhǔn) 21 8 無(wú)鉛工藝 23 8 1 無(wú)鉛工藝曲線 23 43 8 2 普通無(wú)鉛回流焊曲線規(guī)格 25 8 3 在無(wú)鉛過(guò)程中標(biāo)準(zhǔn)校準(zhǔn)板的基本的曲線規(guī)格 26 8 4 無(wú)鉛工藝啟動(dòng)設(shè)置 28 8 5 PWBs 產(chǎn)品回流曲線的測(cè)量 29 9 點(diǎn)膠過(guò)程 30 9 1 概述 30 10 NK ACA SMT 工藝規(guī)格 32 10 1 ACA 技術(shù)介紹 32 10 2 ACA 工藝 32 10 4 ACA 貯藏條件 37 10 5 日立化學(xué)制品 AC 2056T 45 ACF 互聯(lián)設(shè)計(jì)的面積 37 10 6 結(jié)合力計(jì)算 38 11 手工焊接的過(guò)程和手藝標(biāo)準(zhǔn) 39 12 視覺(jué)檢測(cè)的規(guī)格 錯(cuò)誤標(biāo)準(zhǔn) 故障分類(lèi)和培訓(xùn)材料 39 13 相關(guān)文檔 39 44 1 運(yùn)送 存儲(chǔ)和生產(chǎn)環(huán)境 1 1 概述 全球 NK 工作場(chǎng)所資源 NWR 部門(mén)指定和照顧材料存儲(chǔ)和工廠環(huán)境條件 包括 加熱 通風(fēng) 空調(diào) 水 污水 滅火系統(tǒng) 冷卻 特殊 HVAC 真空 焊接排氣等 電力 錯(cuò)誤標(biāo)準(zhǔn) 故障分類(lèi)和培訓(xùn)材料 視覺(jué)檢測(cè)標(biāo)準(zhǔn)被應(yīng)用 NK 文件 NS055 SMD 手藝標(biāo)準(zhǔn) 這個(gè)標(biāo)準(zhǔn)主要根據(jù) ANSI IPC A 610B 電信 2 級(jí)標(biāo)準(zhǔn) 人工裝配代理商可以使用同樣標(biāo)準(zhǔn) 可適用的國(guó)際標(biāo)準(zhǔn) ANSI IPC A 610B 電信 2 級(jí)標(biāo)準(zhǔn) 錯(cuò)誤標(biāo)準(zhǔn)和故障分類(lèi) SMD 手藝標(biāo)準(zhǔn) NS055 培訓(xùn)包 NK 培訓(xùn)包 SMD 手藝標(biāo)準(zhǔn) NS055 以及符合 ANSI IPC A 610B 的培訓(xùn)材料 11 相關(guān)文檔 NS055 SMD 手藝標(biāo)準(zhǔn)存放在運(yùn)轉(zhuǎn)中的全球性 DocMan 數(shù)據(jù)庫(kù) EIA 583 填充料標(biāo)準(zhǔn)為潮濕敏感條款 EIA 541 填充料標(biāo)準(zhǔn)為 ESD 敏感條款 兩個(gè)上述標(biāo)準(zhǔn)可在 NK 內(nèi)部網(wǎng)找到 無(wú)鉛處理規(guī)格在運(yùn)轉(zhuǎn)中的全球性 DocMan 數(shù)據(jù)庫(kù)